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| HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6355 Issued Date : 1993.01.15 Revised Date : 2002.04.29 Page No. : 1/4 HMPSA94 PNP EPITAXIAL PLANAR TRANSISTOR Description The HMPSA94 is designed for application that requires high voltage. Features * High Breakdown Voltage: 400V(Min.) at IC=1mA * High Current: IC=300mA at 25C * Complementary to HMPSA44 TO-92 Absolute Maximum Ratings * Maximum Temperatures Storage Temperature ........................................................................................................ -55 ~ +150 C Junction Temperature ................................................................................................ +150 C Maximum * Maximum Power Dissipation Total Power Dissipation (Ta=25C)............................................................................................. 625 mW * Maximum Voltages and Currents (Ta=25C) VCBO Collector to Base Voltage.................................................................................................. -400 V VCEO Collector to Emitter Voltage .............................................................................................. -400 V VEBO Emitter to Base Voltage......................................................................................................... -6 V IC Collector Current ................................................................................................................. -500 mA Characteristics (Ta=25C) Symbol BVCBO BVCEO BVEBO ICBO IEBO ICES *VCE(sat)1 *VCE(sat)2 *VCE(sat)3 *VBE(sat) *hFE1 *hFE2 *hFE3 *hFE4 Min. -400 -400 -6 40 50 45 40 Typ. Max. -100 -100 -500 -350 -500 -750 -750 300 Unit V V V nA nA nA mV mV mV mV Test Conditions IC=-100uA, IE=0 IC=-1mA, IB=0 IE=-10uA, IC=0 VCB=-400V, IE=0 VEB=-4V, IC=0 VCE=-400V, VBE=0 IC=-1mA, IB=-0.1mA IC=-20mA, IB=-2mA IC=-50mA, IB=-5mA IC=-10mA, IB=-1mA VCE=-10V, IC=-1mA VCE=-10V, IC=-10mA VCE=-10V, IC=-50mA VCE=-10V, IC=-100mA *Pulse Test: Pulse Width 380us, Duty Cycle2% Classification Of hFE2 Rank hFE@VCE=-3V, IC=-100mA hFE2@VCE=-10V, IC=-10mA VCE(sat)@IC=-20mA, IB=-2mA HMPSA94 NSS >50 70-200 <200mV NS >50 70-300 <500mV SD 70-200 <200mV N 50-300 <500mV HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 1000 1000 Spec. No. : HE6355 Issued Date : 1993.01.15 Revised Date : 2002.04.29 Page No. : 2/4 Current Gain & Collector Current 75 C 125 C o o 125 C 100 o 75 C o 100 hFE hFE 25 C o 25 C o 10 10 hFE @ VCE=3V hFE @ VCE=10V 1 0.1 1 10 100 Collector Current IC (mA) 1000 1 0.1 1 10 100 1000 Collector Current IC (mA) Saturation Voltage & Collector Current 100000 75 C o Saturation Voltage & Collector Current 10000 Saturation Voltage (mV) Saturation Voltage (mV) 10000 25 C 1000 o o 75 C 1000 25 C o o 125 C 100 125 C o VCE(sat) @ IC=10IB 10 1 10 100 1000 100 1 10 VBE(sat) @ IC=10IB 100 1000 Collector Current IC (mA) Collector Current IC (mA) Capacitance & Reverase-Biased Voltage 100 Safe Operating Area 10000 PT=1m s PT=100ms 1000 PT=1s Cob 10 Collector Current-I (mA) C 10 100 Capacitance (pF) 100 10 1 0.1 1 1 1 10 100 1000 Reverse-Biased Voltage (V) Forward Biased Voltage-VCE (V) HMPSA94 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6355 Issued Date : 1993.01.15 Revised Date : 2002.04.29 Page No. : 3/4 PD-Ta 700 600 Power Dissipation-PD(mW) 500 400 300 200 100 0 0 20 40 60 80 100 o 120 140 160 Ambient Temperature-Ta( C) HMPSA94 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. TO-92 Dimension A B 1 2 3 Date Code Spec. No. : HE6355 Issued Date : 1993.01.15 Revised Date : 2002.04.29 Page No. : 4/4 2 Marking: H MP S A94 Control Code 3 C Style: Pin 1.Emitter 2.Base 3.Collector D H I E F G 1 3-Lead TO-92 Plastic Package HSMC Package Code: A *: Typical DIM A B C D E F Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480 Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76 DIM G H I 1 2 3 Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 *5 *2 *2 Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 *5 *2 *2 Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material: * Lead: 42 Alloy; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: * Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 * Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HMPSA94 HSMC Product Specification |
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